PM Modi lays foundation of 3 semiconductor facilities worth Rs 1.25 lakh crore

Addressing ‘India’s Techade: Chips for Viksit Bharat’ programme via video conferencing, Indian Prime Minister Narendra Modi laid the foundation stone for three semiconductor projects worth about INR 1.25 lakh crore (USD 15 billion). The facilities are - Semiconductor fabrication facility at the Dholera Special Investment Region (DSIR), Gujarat; Outsourced Semiconductor Assembly and Test (OSAT) facility at Morigaon, Assam; and the Outsourced Semiconductor Assembly and Test (OSAT) facility at Sanand, Gujarat.

The prime minister, while addressing the occasion said that today’s historic occasion was a significant step towards a bright future for India as foundation stones were laid for three major semiconductor manufacturing projects worth about INR 1.25 lakh crore in Dholera and Sanand in Gujarat and Moregaon in Assam.

“Today’s projects will play a key role in making India a semiconductor hub,” PM Modi said, as he congratulated the citizens for the key initiatives. He noted the virtual presence of semiconductor industry players from Taiwan and expressed excitement for today’s occasion. The Prime Minister noted that more than 60,000 colleges, universities and educational institutes were connected with the event. Terming today’s programme as the event of the dreams of the youth of the nation, Modi said they were the real stakeholders of the future of India.

Stressing upon the need to utilise every second, Modi presented the event as an example of the speed with which the government was working. Explaining the sequence of the strides made in the semiconductor field, the prime minister talked about the announcement of the semiconductor mission two years ago and how, within a few months, the first MoUs were signed and now the foundation stones for three projects were laid.