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NEWS

ADATA launches XPG SPECTRIX D80 RGB DDR4 with a hybrid liquid-air cooling system


By VARINDIA - 2018-08-08
ADATA launches XPG SPECTRIX D80 RGB DDR4 with a hybrid liquid-air cooling system

ADATA Technology has launched XPG SPECTRIX D80 DDR4 RGB with a hybrid liquid-air cooling system. The SPECTRIX D80 is a state-of-the-art device that operates with a combination of a liquid heatsink, an aluminum heatsink and thermally conductive materials on the PCB. In addition, it offers comprehensive thermal cooling capabilities and delivers an outstanding performance.

 

A liquid heatsinks on the top of the SPECTRIX D80 benefits from a non-conductive fluid to dissipate heat efficiently. It works in conjunction with an aluminum heatsink and thermally conductive materials on the PCB to offer comprehensive cooling. Equipped with programmable RGB lighting, the liquid heatsink is not just functional, but also visually captivating with the fluid completely illuminated for all to see. Users can customize the lighting effects by setting up patterns, pulse speed, lighting intensity, and more.

 

Made for avid gamers, DIY enthusiasts, and overclockers, the SPECTRIX D80 provides a wide frequency range from 2,666 MHz to 5,000 MHz with support for Intel X299 2666 MHz and AMD AM4/Ryzen platforms. Also, pre-configured Intel XMP (Extreme Memory Profile) 2.0 profiles allow for quick overclocking, doing away with the need for adjusting individual parameters in BIOS. Earlier in the year, XPG overclocked the SPECTRIX D80 to 5,531 MHz in a liquid-nitrogen-cooled configuration to demonstrate the amazing potential of the memory module.

 

For more reliability and dependability, the module uses high-quality chips chosen through a strict selection process, while its 10-layer PCB offers improved signalling quality and stability, even when operating at high speeds or under heavy loads.

 

ADATA XPG first introduced a prototype liquid-cooled memory design during CES 2018 in Las Vegas to much excitement. The XPG SPECTRIX D80 is the realization of the design’s viability for a commercially available memory module.

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